Technical Details

• Features Open Frame
• Mounting Type Through Hole
• Type DIP, 0.3" (7.62mm) Row Spacing
• Operating Temperature -40°C ~ 105°C
• Number of Positions or Pins (Grid) 20 (2 x 10)
• Termination Solder
• Housing Material Polybutylene Terephthalate (PBT), Glass Filled
• Pitch - Mating 0.100" (2.54mm)
• Contact Finish - Mating Gold
• Contact Finish Thickness - Mating Flash
• Contact Material - Mating Beryllium Copper
• Pitch - Post 0.100" (2.54mm)
• Contact Finish - Post Tin
• Contact Finish Thickness - Post 196.9µin (5.00µm)
• Contact Material - Post Beryllium Copper
• ECCN EAR99
• HTSUS 8536.69.4040
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant