技术参数

• Package / Case 153-TFBGA
• Mounting Type Surface Mount
• Memory Size 128Gbit
• Memory Type Non-Volatile
• Operating Temperature -25°C ~ 85°C
• Technology FLASH - NAND (TLC)
• Memory Format FLASH
• Supplier Device Package 153-BGA (11.5x13)
• Memory Interface eMMC
• Memory Organization 16G x 8
• RoHS Status ROHS3 Compliant