技术参数

• Package / Case 165-BFCPGA
• Mounting Type Through Hole
• Memory Size 72Mbit
• Memory Type Volatile
• Operating Temperature -55°C ~ 125°C (TA)
• Voltage - Supply 1.7V ~ 1.9V
• Technology SRAM - Synchronous, QDR II+
• Clock Frequency 250 MHz
• Memory Format SRAM
• Supplier Device Package 165-CCGA (21x25)
• Memory Interface Parallel
• Memory Organization 2M x 36
• DigiKey Programmable Not Verified
• ECCN 3A001A2C
• HTSUS 8542.32.0041
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status RoHS non-compliant