技术参数

• Package / Case Module
• Frequency 33 GHz ~ 50 GHz
• Type Isolator
• Insertion Loss 1.3dB
• VSWR 1.3
• Isolation 25dB
• Supplier Device Package Module
• Power - Average Forward 1.5 W
• ECCN EAR99
• HTSUS 8529.10.9000